Effects of ESD and EMI on TMR heads during bonding process of gold ball bonding machines

ESD and EMI are important issue in HDD. Ball bond machine makes a micro electrical connection; and this involves high voltage and high frequency current. Other works had only investigated ESD effect. This work newly presents the investigation of the severity of both ESD and EMI on MR heads. Discharge current was captured by a current transducer. EMI effect was monitored using finite integral. The experiments show discharge current was as high as few A. EMI simulations illustrate interference on a current transducer. The benefit of this work leads to higher accuracy in measurement at high frequency range.