Optical coupling of a SMF to flip-chip bonded laser diode for low-cost subscriber´s transmitter module

Author

Joo, G.C. ; Lee, S.H. ; Moon, J.T. ; Hwang, N. ; Song, M.K. ; Pyun, K.E.

Author_Institution

Div. of Semicond., Electron. & Telecommun. Res. Inst., Taejon, South Korea

Volume

2

fYear

1997

fDate

10-13 Nov 1997

Firstpage

128

Abstract

In this paper, we present a noble optical coupling technique for low-cost subscriber´s module in terms of coupling efficiency and its stability issues. For efficient passive integration of a single mode fibre (SMF) and optical devices, silicon submounts were designed to minimize the alignment degree of freedom

Keywords

flip-chip devices; laser stability; modules; optical fibre couplers; optical fibre subscriber loops; optical transmitters; packaging; semiconductor device packaging; semiconductor lasers; alignment degree of freedom; efficient passive integration; flip-chip bonded laser diode; low-cost subscriber transmitter module; optical coupling; optical devices; silicon submounts; single mode fibre; stability issues; Diode lasers; Electronics packaging; Etching; Optical coupling; Optical devices; Optical fiber devices; Optical transmitters; Silicon; Stability; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE

Conference_Location

San Francisco, CA

ISSN

1092-8081

Print_ISBN

0-7803-3895-2

Type

conf

DOI

10.1109/LEOS.1997.645301

Filename

645301