The packaging of large spot-size semiconductor optical amplifiers

Author

Collins, J.V. ; Kelly, A. ; Ford, C.W. ; Lealman, I.F.

Author_Institution

British Telecom Res. Labs., Ipswich, UK

Volume

2

fYear

1997

fDate

10-13 Nov 1997

Firstpage

132

Abstract

By matching the emission spot size of the semiconductor device to that of a singlemode fibre the packaging processes become much simpler. Results from large spot semiconductor amplifiers which can be assembled in conventional or low cost passive configurations have been reported. These devices have both the performance and, in the passively aligned package the very low cost needed to dramatically affect the architecture of future telecommunication networks

Keywords

laser modes; optical transmitters; semiconductor device packaging; semiconductor lasers; emission spot size; large spot semiconductor amplifiers; large spot-size semiconductor optical amplifier packaging; low cost passive configurations; packaging processes; passively aligned package; semiconductor device; singlemode fibre; very low cost; Electrons; Fiber lasers; Optical amplifiers; Optical devices; Optical fiber amplifiers; Optical fiber devices; Optical fiber polarization; Semiconductor device packaging; Semiconductor optical amplifiers; Stimulated emission;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE

Conference_Location

San Francisco, CA

ISSN

1092-8081

Print_ISBN

0-7803-3895-2

Type

conf

DOI

10.1109/LEOS.1997.645304

Filename

645304