Title :
The packaging of large spot-size semiconductor optical amplifiers
Author :
Collins, J.V. ; Kelly, A. ; Ford, C.W. ; Lealman, I.F.
Author_Institution :
British Telecom Res. Labs., Ipswich, UK
Abstract :
By matching the emission spot size of the semiconductor device to that of a singlemode fibre the packaging processes become much simpler. Results from large spot semiconductor amplifiers which can be assembled in conventional or low cost passive configurations have been reported. These devices have both the performance and, in the passively aligned package the very low cost needed to dramatically affect the architecture of future telecommunication networks
Keywords :
laser modes; optical transmitters; semiconductor device packaging; semiconductor lasers; emission spot size; large spot semiconductor amplifiers; large spot-size semiconductor optical amplifier packaging; low cost passive configurations; packaging processes; passively aligned package; semiconductor device; singlemode fibre; very low cost; Electrons; Fiber lasers; Optical amplifiers; Optical devices; Optical fiber amplifiers; Optical fiber devices; Optical fiber polarization; Semiconductor device packaging; Semiconductor optical amplifiers; Stimulated emission;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3895-2
DOI :
10.1109/LEOS.1997.645304
