Title :
New copper multi layer interconnection technologies for power electronics
Author :
Curley, Michael ; Rapoport, Nahum ; Suconick, David
Author_Institution :
REMTEC, Canton, MA, USA
Abstract :
Novel copper multi layer board technologies on ceramic and insulated metal substrates (IMSs), with high current carrying and multilayer capabilities, have been developed. The copper-on-ceramic version is compatible with conventional thick-film technology. Experimental data, comprehensive testing, and thermal evaluation results are presented, along with some typical power electronics applications
Keywords :
packaging; power electronics; printed circuit manufacture; printed circuit testing; ceramic substrates; copper multi layer interconnection technologies; insulated metal substrates; power electronics; thermal evaluation results; thick-film technology; Assembly; Ceramics; Conducting materials; Copper; Integrated circuit interconnections; Nonhomogeneous media; Power electronics; Substrates; Thermal conductivity; Thick films;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1992. APEC '92. Conference Proceedings 1992., Seventh Annual
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-0485-3
DOI :
10.1109/APEC.1992.228353
