DocumentCode
3265843
Title
Design and Development of Component-based Equipment Connectivity for Semiconductor Manufacturing
Author
Qiu, Robin ; Laplante, Phillip
Author_Institution
Dept. of Information Sciences, Pennsylvania State University, Malvern, PA 19355
fYear
2003
fDate
12-12 June 2003
Firstpage
63
Lastpage
67
Abstract
In the Semiconductor Industry, the communication between a host application and equipment is performed using some standardized communication protocols, such as SECS I, SECS II, or GEM. However, specific equipment requirements and proprietary messages frequently make the equipment connectivity non-interoperable. By taking advantage of component software computing technology, a generic equipment integration interface called Component-based Equipment Connectivity (CEC) is proposed. CEC is designed as an assemblage of various customizable components, such as communication, message/control, and data repository. When these components are instantiated with equipment-dependent parameters, an operational CEC can be created for a specific type of GEM-compliant semiconductor equipment. Using XML as the data representation vehicle, communicated messages become language/platform independent and ease of integration is promoted.
fLanguage
English
Publisher
ieee
Conference_Titel
Control and Automation, 2003. ICCA '03. Proceedings. 4th International Conference on
Conference_Location
Montreal, Que., Canada
Print_ISBN
0-7803-7777-X
Type
conf
DOI
10.1109/ICCA.2003.1594985
Filename
1594985
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