Title :
OPTOBUS(TM): a parallel interconnect solution
Author :
Norton, L.J. ; Carney, F. ; Denton, R.K., Jr. ; Fauty, J. ; Geist, H. ; James, D. ; Knapp, J.H. ; Planer, S. ; Raskin, G. ; Reyes, E. ; Sauvageau, J.E. ; Schwartz, D.B. ; Stradling, R. ; Westbrook, G.
Author_Institution :
Adv. Package Design & Autom. Center, Motorola Inc., Chandler, AZ, USA
Abstract :
OPTOBUSTM is a ten channel parallel bi-directional link rated at 400 Mb/s per channel. Engineered as a DC coupled link, OPTOBUS can be used as a drop in replacement for parallel copper cable but with the ability to handle distances up to 300 meters. Electrically this places stringent constraints on the ICs and packaging but makes system integration simpler for the customer. Physically the user is presented with a PGA on a 14×14 array with two transceiver connectors, HIPER TM Link, developed for OPTOBUS and designed around the MT ferrule with 62.5 μm graded index fibers. OPTOBUS incorporates several key technologies. Vertical cavity surface emitting lasers (VCSEL) simplify the packaging since light is emitted perpendicular to the wafer surface. This feature permits wafer level probing and convenient array fabrication for parallel applications; GUIDECASTTM is Motorola´s internally developed molded-plastic waveguide array that controls the beam characteristics to meet FDA class 1 laser safety requirements and provides a robust mechanical interface. The electrical interconnection to the optoelectronic devices is achieved through a tape automated bonded lead frame. These technologies, combined with the features of the VCSEL, allows the fundamental design choice to bend the electrical path to produce an optical path parallel to the substrate surface. Custom silicon driver and receiver ICs are designed around the packaging parasitics using mature silicon processes
Keywords :
data communication; data communication equipment; integrated circuit packaging; integrated optoelectronics; multichip modules; optical interconnections; optical transmitters; parallel architectures; semiconductor laser arrays; surface emitting lasers; tape automated bonding; 300 m; 400 Mbit/s; DC coupled link; GUIDECAST; HIPER Link; MCM-L substrate; OPTOBUS; PGA; VCSEL; drop in replacement; electrical interconnection; ferrule; graded index fibers; laser safety requirements; module; molded-plastic waveguide array; optical interconnects; optoelectronic devices; packaging; parallel interconnect; robust mechanical interface; system integration; tape automated bonded lead frame; ten channel parallel bi-directional link; transceiver connectors; wafer level probing; Bidirectional control; Copper; Optical arrays; Optical receivers; Optical surface waves; Packaging; Silicon; Surface emitting lasers; Vertical cavity surface emitting lasers; Waveguide lasers;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3895-2
DOI :
10.1109/LEOS.1997.645351