Title :
Fabrication of multi-channel tapered optical fiber array package using laser welding technique
Author :
Kang, S.G. ; Song, M.K. ; Moon, J.T. ; Lee, H.T. ; Lee, S.H. ; Hwang, N. ; Park, S.S. ; Oh, K.R. ; Pyun, K.E.
Author_Institution :
Compound Semicond. Dept., Electron. & Telecommun. Res. Inst., Taejeon, South Korea
Abstract :
As optical transmission capacity increases, the application of multi-fiber array technology is becoming more popular in many areas. Tapered fiber array is used to compensate the mode-field diameter mismatch of a device resulting in high optical coupling efficiency. As the radius of a fiber tip decreases, optical coupling efficiency increases with the trade-off of optical alignment tolerance. Therefore, for higher optical coupling efficiency, more accurate alignment processes between the components and reliable assembly methods are necessary. Compared with soldering or the epoxy bonding technique, the laser welding technique is well known as a reliable fixing method for optical component packages. However, careful design of welding components for fixing tapered fiber array is required to obtain low post weld shift. In this study, the effect of laser welding processes on the optical misalignment of the arrayed fibers is investigated using semiconductor optical switch devices
Keywords :
arrays; laser beam welding; optical fibre couplers; optical fibre fabrication; optical fibres; packaging; U-channel technique; fabrication; high optical coupling efficiency; laser welding; low post weld shift; mode-field diameter mismatch; multi-channel tapered optical fiber array package; multi-fiber array technology; optical alignment tolerance; optical component packages; optical misalignment; semiconductor optical switch devices; Fiber lasers; Optical arrays; Optical coupling; Optical device fabrication; Optical devices; Optical fiber devices; Optical fibers; Packaging; Semiconductor laser arrays; Welding;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3895-2
DOI :
10.1109/LEOS.1997.645353