Advanced electronic cooling technologies

Author

Wang, Yanjin ; Luo, Qinghai ; Chen, Xiaoming

Author_Institution

Univ. of South China, Hengyang, China

fYear

2009

fDate

19-21 Jan. 2009

Firstpage

149

Lastpage

152

Abstract

This paper introduces the research status of electronic cooling based on the development trend of the electronic technology. The technical characteristics of heat pipes, thermoelectric cooler, phase change cooling and microchannel heat sink are analyzed. These technologies are advanced cooling methods for large power electronic equipments and high heat flux density electronic elements. However, different technique has different advantage and disadvantage. Reasonable selection and optimization of cooling technologies according to the characteristics of cooling objects.

Keywords

cooling; heat pipes; heat sinks; thermoelectric devices; advanced electronic cooling technologies; electronic technology; heat pipes; high heat flux density electronic elements; large power electronic equipments; microchannel heat sink; phase change cooling; thermoelectric cooler; Electronics cooling; Filling; Heat sinks; Heat transfer; Microchannel; Paper technology; Resistance heating; Temperature; Thermal resistance; Thermoelectricity; electronic cooling; heat pipes; microchannel heat sink; phase change cooling; thermoelectric cooler;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics & Electronics, 2009. PrimeAsia 2009. Asia Pacific Conference on Postgraduate Research in

Conference_Location

Shanghai

Print_ISBN

978-1-4244-4668-1

Electronic_ISBN

978-1-4244-4669-8

Type

conf

DOI

10.1109/PRIMEASIA.2009.5397426

Filename

5397426