Silicon-based MEMS process and standardization

Author

Hao, Yilong ; Zhang, Dacheng

Author_Institution

Inst. of Microelectron., Peking Univ., Beijing, China

Volume

3

fYear

2004

fDate

18-21 Oct. 2004

Firstpage

1835

Abstract

This paper, reviewing the development history of MEMS technology, summarizes the developing trend of current MEMS fabrication techniques. To realize the miniaturization and 3D fabrication of MEMS device, multi-layer techniques, SOI techniques and integration are the main developing directions of current MEMS. Standardization is an important tool of MEMS research and the standardization process covers two platforms: the soft platform and the hard platform, which will exert relatively large driving forces to MEMS device research.

Keywords

elemental semiconductors; integrated circuit technology; micromachining; micromechanical devices; silicon; silicon-on-insulator; standardisation; 3D fabrication; MEMS fabrication techniques; MEMS process standardization; SOI techniques; Si; bulk micromachining; device integration; hard platform standardization; multilayer techniques; silicon-based MEMS process; soft platform standardization; surface micromachining; Bonding; CMOS process; Circuits; Etching; Fabrication; Manufacturing processes; Microelectromechanical devices; Micromachining; Micromechanical devices; Standardization;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on

Print_ISBN

0-7803-8511-X

Type

conf

DOI

10.1109/ICSICT.2004.1435192

Filename

1435192