Next generation automotive electronics: the impact on technologies and design methodologies

Author

Melbert, J.G.

Author_Institution

Siemens Semicond., Munich, Germany

fYear

1992

fDate

4-6 June 1992

Firstpage

8

Lastpage

11

Abstract

Third-generation automotive electronics systems, like antiskid braking, electronic suspension, or four-wheel steering, which consist of complex VLSI circuits, are discussed. The semiconductor technologies they use for smart sensors and power ICs, among them CMOS, bipolar, and BiCMOS, are examined. Smart power processes enable analog, digital, and power functions to be combined on one chip. Usually, they combine bipolar, CMOS, and DMOS structures. Depending on the number of output channels, the processes are optimized for single or multiple outputs. A technique for improved microcontroller performance in automotive electronics is described.<>

Keywords

BIMOS integrated circuits; automotive electronics; intelligent sensors; microcontrollers; mixed analogue-digital integrated circuits; power integrated circuits; VLSI circuits; active suspension; antiskid braking; automotive electronics; design methodologies; electronic suspension; four-wheel steering; impact on technologies; microcontroller performance; power ICs; semiconductor technologies; smart sensors; third generation automotive systems; Automotive electronics; Automotive engineering; CMOS technology; Design methodology; Intelligent sensors; Microcontrollers; Power integrated circuits; Vehicles; Very large scale integration; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Circuits, 1992. Digest of Technical Papers., 1992 Symposium on

Conference_Location

Seattle, WA, USA

Print_ISBN

0-7803-0701-1

Type

conf

DOI

10.1109/VLSIC.1992.229261

Filename

229261