Title :
Fiber circuits for packaging and interconnection
Author_Institution :
Lucent Technol., Bell Labs., Princeton, NJ, USA
Abstract :
Perhaps the major impediment to more efficient manufacturing of telecommunications optical systems is the lack of more efficient means of assembling and packaging high fiber counts. We will review recent applications that make use of novel techniques for designing and using machine-made fiber interconnection fabrics
Keywords :
assembling; integrated optoelectronics; optical fabrication; optical fibre communication; optical fibre couplers; optical interconnections; packaging; assembling; fiber circuit packaging; fiber circuits interconnections; high fiber counts; machine-made fiber interconnection fabrics; manufacturing; optical design; optical fabrication; review; telecommunications optical systems; Costs; Fabrics; High speed optical techniques; Integrated circuit interconnections; Optical attenuators; Optical fiber cables; Optical fiber devices; Optical fibers; Optical interconnections; Packaging;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3895-2
DOI :
10.1109/LEOS.1997.645416
