• DocumentCode
    3268226
  • Title

    A study on a High Quality CAE Analysis Approach Model

  • Author

    Onodera, Takehiro ; Amasaka, Kakuro

  • Author_Institution
    Manage. Technol., Aoyama Gakuin Univ., Sagamihara, Japan
  • fYear
    2011
  • fDate
    20-22 Dec. 2011
  • Firstpage
    1379
  • Lastpage
    1382
  • Abstract
    In recent years, enhancing computer-aided engineering (CAE) analysis is the most pressing issue facing companies seeking to implement development design that results in high quality and shortened delivery times. This paper presents a “High Quality CAE Analysis Approach Model” that can be used to reform the business processes associated with development design. The model consists of the following steps: (1) defining the problem, (2) conducting prototype testing, (3) visualizing the problem, (4) employing the CAE technological element analysis model, (5) conducting a two-dimensional CAE analysis, (6) conducting a three-dimensional CAE analysis, (7) carrying out a predictive evaluation, (8) optimizing the design, and (9) verifying the results. As a specific application for this process, the authors focused on the ongoing problem of bolt loosening at automakers, using the model to explain the loosening mechanism by analyzing the contact stress at the bearing surfaces in bolted parts and gain new knowledge.
  • Keywords
    automobile industry; automobile manufacture; automotive components; computer aided engineering; design engineering; fasteners; machine bearings; stress analysis; CAE technological element analysis model; automakers; automotive bolts tightening analysis; bearing surfaces; bolt loosening; bolted parts; business processes; computer-aided engineering analysis; contact stress simulation; design optimization; development design; high quality CAE analysis approach model; loosening mechanism; predictive evaluation; prototype testing; Analytical models; Computational modeling; Computer aided engineering; Fasteners; Numerical models; Solid modeling; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Integration (SII), 2011 IEEE/SICE International Symposium on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4577-1523-5
  • Type

    conf

  • DOI
    10.1109/SII.2011.6147650
  • Filename
    6147650