DocumentCode
3268226
Title
A study on a High Quality CAE Analysis Approach Model
Author
Onodera, Takehiro ; Amasaka, Kakuro
Author_Institution
Manage. Technol., Aoyama Gakuin Univ., Sagamihara, Japan
fYear
2011
fDate
20-22 Dec. 2011
Firstpage
1379
Lastpage
1382
Abstract
In recent years, enhancing computer-aided engineering (CAE) analysis is the most pressing issue facing companies seeking to implement development design that results in high quality and shortened delivery times. This paper presents a “High Quality CAE Analysis Approach Model” that can be used to reform the business processes associated with development design. The model consists of the following steps: (1) defining the problem, (2) conducting prototype testing, (3) visualizing the problem, (4) employing the CAE technological element analysis model, (5) conducting a two-dimensional CAE analysis, (6) conducting a three-dimensional CAE analysis, (7) carrying out a predictive evaluation, (8) optimizing the design, and (9) verifying the results. As a specific application for this process, the authors focused on the ongoing problem of bolt loosening at automakers, using the model to explain the loosening mechanism by analyzing the contact stress at the bearing surfaces in bolted parts and gain new knowledge.
Keywords
automobile industry; automobile manufacture; automotive components; computer aided engineering; design engineering; fasteners; machine bearings; stress analysis; CAE technological element analysis model; automakers; automotive bolts tightening analysis; bearing surfaces; bolt loosening; bolted parts; business processes; computer-aided engineering analysis; contact stress simulation; design optimization; development design; high quality CAE analysis approach model; loosening mechanism; predictive evaluation; prototype testing; Analytical models; Computational modeling; Computer aided engineering; Fasteners; Numerical models; Solid modeling; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
System Integration (SII), 2011 IEEE/SICE International Symposium on
Conference_Location
Kyoto
Print_ISBN
978-1-4577-1523-5
Type
conf
DOI
10.1109/SII.2011.6147650
Filename
6147650
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