• DocumentCode
    3268230
  • Title

    Thermal simulation and validation of 5W high power LED luminaire

  • Author

    Barbosa, Jose Luiz F. ; Calixto, Wesley P. ; Lima, Rodrigo A. ; Alves, Aylton J. ; Domingues, Elder G.

  • Author_Institution
    Program in Electron. Syst. & Autom., Univ. of Brasilia, Brasilia, Brazil
  • fYear
    2015
  • fDate
    10-13 June 2015
  • Firstpage
    2216
  • Lastpage
    2220
  • Abstract
    This paper presents initial studies on thermal heat dissipation in a high-power 5W LED (Light Emitting Diode) luminaire. Two types of heat sinks are proposed, and three thermal simulations are presented through an analysis by finite element methods (FEM). The first simulation considers a luminaire consisting of a confinement, a LED, and a star shaped heat sink base attached. The second simulation proposes an external heat sink. The third simulation proposes a new heat sink model. From the results, it was possible to design and build a prototype and test different cooling structures and heat dissipation issued by the LED. The results of experimental tests that were held with and without external heat sink are matched with simulation results. The major goal of this study is to know the thermal management of LED luminaires by simulation, in order to optimize geometry, material, and LED layout in a luminaire.
  • Keywords
    LED lamps; cooling; finite element analysis; heat sinks; thermal management (packaging); FEM; cooling structure; finite element method; heat sink; high power LED luminaire; light emitting diode; power 5 W; thermal heat dissipation; thermal management; thermal simulation; Geometry; Heat sinks; Heat transfer; Heating; Light emitting diodes; Mathematical model; LED luminaire; finite element methods; high power LED; thermal heat dissipation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Environment and Electrical Engineering (EEEIC), 2015 IEEE 15th International Conference on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4799-7992-9
  • Type

    conf

  • DOI
    10.1109/EEEIC.2015.7165526
  • Filename
    7165526