Title :
Prototyping with surface mount
Author :
Laschinski, Robert A.
Author_Institution :
Capital Adv. Technol. Inc., Carol Stream, IL, USA
Abstract :
The surface mount universal board concept as well as low cost assembly and soldering methods outlined can put surface mount technology within the reach of any engineer having the need or desire to use surface mount components. At a minimum many circuit designs can be tested and developed easily, and the possibility exists that small production quantities of custom circuit networks or modules could be produced with a minimum investment in equipment
Keywords :
assembling; printed circuit manufacture; soldering; surface mount technology; assembly; circuit designs; custom circuit networks; minimum investment; production quantities; prototyping; soldering methods; surface mount; universal board concept; Assembly; Circuit synthesis; Circuit testing; Costs; Design engineering; Investments; Production; Prototypes; Soldering; Surface-mount technology;
Conference_Titel :
WESCON/'93. Conference Record,
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-9970-6
DOI :
10.1109/WESCON.1993.488483
