• DocumentCode
    3268480
  • Title

    Dynamic temperature-aware task scheduling based on sliding window model for MPSoCs

  • Author

    Wang, Luguang ; Jia, Zhiping ; Li, Xin ; Li, Yang ; Qiu, Meikang

  • Author_Institution
    Sch. of Comput. Sci. & Technol., Shandong Univ., Jinan, China
  • fYear
    2011
  • fDate
    18-20 Jan. 2011
  • Firstpage
    98
  • Lastpage
    103
  • Abstract
    As the power density of modern chips increases drastically, chips are prone to overheating. Thermal hot spots increase cooling costs, negatively impact reliability and degrade performance. A valid task scheduling can reduce chip´s average temperature and temperature variations. We propose a dynamic temperature-aware task scheduling policy based on sliding window model. This scheduling policy calculates the probability of task allocation for each core according to current and historical temperatures of the core, and then the one with the maximal probability is chosen to execute the ready task. If multiple cores have the same probability, the scheduler gives priority to the core that has the minimal average temperature of neighbor units. The experimental results show that this scheduling policy can reduce hot spots, decrease spatial and temporal temperature variations of all units, and thus achieve a relatively lower average temperature and more balanced temperature distribution.
  • Keywords
    microprocessor chips; multiprocessing systems; probability; reliability; system-on-chip; MPSoC; balanced temperature distribution; chip average temperature; dynamic temperature-aware task scheduling; maximal probability; multiprocessor systents-on-chip; power density; sliding window model; task allocation; temperature variation; thermal hot spot; Voltage control; HotSpot; multicore task scheduling; multiprocessor systems-on-chips (MPSoCs); sliding window; temperature-aware;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Computer Control (ICACC), 2011 3rd International Conference on
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-8809-4
  • Electronic_ISBN
    978-1-4244-8810-0
  • Type

    conf

  • DOI
    10.1109/ICACC.2011.6016375
  • Filename
    6016375