Title :
A RFID-enabled Tracking System in Wire Bond Station of an IC packaging assemble line
Author :
Wang, W.L. ; Liu, Y.J. ; Wang, S.J.
Author_Institution :
Dept. of Ind. Eng. & Manage., Nat. Chin-Yi Univ. of Technol., Taiping, Taiwan
Abstract :
IC industry with the rapid development of science and technology, and product diversification, and reduce the life cycle. How to accurately control the progress of the production line to meet the customer requirement is an important issue. Packaging and assemble is the last process for IC final product. The Wire bond stations are the most variation in the packaging and assemble process. For the purpose to enhance the overall performance, this paper proposes a RFID-enabled Tracking System in Wire Bond Station (RTSWB). Through RTSWB, we can real-time monitor and track production lots (the delay of work-in-process, the qualification lots and the rejection lots of semi-product) and the maintenance of wire bond machines. Based on the statistics hypothesis, we compare the before and after introducing RTSWB. The results show significant difference and clear efficiency for performance improvement.
Keywords :
Assembly systems; Bonding; Condition monitoring; Delay; Electrical equipment industry; Integrated circuit packaging; Production; Qualifications; Statistics; Wire; IC Packaging; RFID; Tracking; Wire Bond;
Conference_Titel :
RFID-Technology and Applications (RFID-TA), 2010 IEEE International Conference on
Conference_Location :
Guangzhou, China
Print_ISBN :
978-1-4244-6698-6
DOI :
10.1109/RFID-TA.2010.5529881
