DocumentCode
3270210
Title
Effect of low surface tension liquid on pattern collapse analyzed by dynamical meniscus observation
Author
Kawai, Akira ; Suzuki, Kenta
Author_Institution
Dept. of Electr. Eng., Nagaoka Univ. of Technol., Japan
fYear
2005
fDate
25-28 Oct. 2005
Firstpage
70
Lastpage
71
Abstract
It is well known that Laplace force affects strongly to the resist pattern collapse phenomena during pattern development procedure (Tanaka et al., 1993). Recently, it is reported that the pattern collapse can be improved by using the low surface tension liquid (Tanaka et al., 1993). So far, we reported the air tunnel formation in the bottom meniscus during drying process (Ishikawa et al., 2004). It was clearly observed that the water meniscus enters from the both bottom edges of the parallel pattern. The purpose of this study is to clarify the drying behavior of the meniscus between the parallel thin films, when the low surface tension liquid is employed as the rinse liquid.
Keywords
drying; resists; surface tension; thin films; Laplace force; drying behavior; dynamical meniscus observation; low surface tension liquid; parallel thin films; resist pattern collapse; rinse liquid; water meniscus; Pattern analysis; Plastic films; Polyethylene; Positron emission tomography; Resists; Shape; Stress; Surface tension; Transistors; Visualization;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2005 International
Print_ISBN
4-9902472-2-1
Type
conf
DOI
10.1109/IMNC.2005.203742
Filename
1595218
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