• DocumentCode
    3270295
  • Title

    Distributed Processing Mechanism utilizing PCI Backplane for 3G Node-B

  • Author

    Yeoh, Chun Yeow

  • Author_Institution
    UPM-MTDC Technol. Incubation Center One, Serdang
  • fYear
    2007
  • fDate
    20-24 March 2007
  • Firstpage
    58
  • Lastpage
    62
  • Abstract
    The typical base transceiver station (BTS) or node-B architecture can be partitioned onto radio frequency (RF) module, baseband module, transport module and control module. The control, transport and baseband modules run their own standard protocols defined in 3GPP. Our node-B has mapped all these modules onto its own data acquisition board utilizing the PCI backplane. This paper describes the communication mechanism between the different data acquisition boards based on the compact PCI (cPCI) platforms. The features available in the PCI bridges in different data acquisition boards have been carefully studied before designing the communication mechanism. Furthermore, the mechanism is developed based on the understanding of the traffic characteristics found in a typical 3G node-B. We present the experimental results of our communication mechanism. The numerical calculation results have proved that our system is capable for supporting the data throughput up to 14 UL/DL 384 kbps user channels.
  • Keywords
    3G mobile communication; data acquisition; distributed processing; peripheral interfaces; telecommunication computing; transceivers; 3G node-B; 3GPP; PCI backplane; base transceiver station; baseband module; control module; data acquisition board; distributed processing; radiofrequency module; transport module; Backplanes; Baseband; Bridges; Communication system control; Data acquisition; Distributed processing; Radio control; Radio frequency; Transceivers; Transport protocols; Compact PCI; Distributed Data Processing; Real Time System;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integration Technology, 2007. ICIT '07. IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    1-4244-1092-4
  • Electronic_ISBN
    1-4244-1092-4
  • Type

    conf

  • DOI
    10.1109/ICITECHNOLOGY.2007.4290374
  • Filename
    4290374