• DocumentCode
    3271182
  • Title

    Packaging sciences research at the Semiconductor Research Corporation (SRC)

  • Author

    Bracken, R.C.

  • Author_Institution
    Semicond. Res. Corp., Research Triangle Park, NC
  • fYear
    1996
  • fDate
    28-30 Oct 1996
  • Firstpage
    3
  • Lastpage
    4
  • Abstract
    The SRC is a non-profit corporation which has as its mission improving the competitiveness of its member companies in semiconductor technology. Its charter is to fund university research focused on areas relevant to its member companies longer term, strategic needs. SRC has the dual goals of supporting graduate training of students in semiconductor technology, and the production of research results. In carrying out this mission, research is supported in the areas of lithography, process integration and devices, materials and bulk sciences, factory sciences, interconnects, IC design, and packaging. Packaging Sciences is ll% of the SRC operating budget of approximately $30M. Its mission is to support and manage research programs that develop the design of packaging for the high speed, high power, high I/O circuits used in the next 5-10 year timeframe as projected in National Technology Roadmap for Semiconductors (NTRS)
  • Keywords
    integrated circuit packaging; power integrated circuits; research and development management; NTRS; National Technology Roadmap for Semiconductors; Semiconductor Research Corporation; high I/O circuits; high power circuits; high-speed circuits; packaging sciences research; research programs; semiconductor technology; training;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
  • Conference_Location
    Napa, CA
  • Print_ISBN
    0-7803-3514-7
  • Type

    conf

  • DOI
    10.1109/EPEP.1996.564756
  • Filename
    564756