DocumentCode :
327122
Title :
SiC devices for power and high-temperature applications
Author :
Wondrak, W. ; Niemann, E. ; Held, K. ; Constapel, R. ; Kroetz, G.
Author_Institution :
Daimler-Benz AG, Frankfurt, Germany
Volume :
1
fYear :
1998
fDate :
7-10 Jul 1998
Firstpage :
153
Abstract :
Silicon carbide is a semiconductor material with superior properties compared with silicon or gallium arsenide. The main advantages concern high-temperature, high-power, high-frequency, and radiation hardened applications. In the first part of the paper, the material characteristics of SiC will be reviewed from a device point of view and the main application fields for SiC devices are summarized. In the second part, an overview of the current status of SiC devices and circuits is given. Special emphasis is put on high-temperature operation. These new devices enable advanced applications in power industry and mobile systems. Transfer to production seems to be possible within the next few years, being mainly a question of substrate quality and cost
Keywords :
power electronics; semiconductor materials; silicon compounds; SiC; SiC devices; high-frequency applications; high-temperature applications; material characteristics; power applications; radiation hardened applications; semiconductor material; Leakage current; MOSFETs; Power electronics; Rectifiers; Schottky barriers; Schottky diodes; Silicon carbide; Switching loss; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics, 1998. Proceedings. ISIE '98. IEEE International Symposium on
Conference_Location :
Pretoria
Print_ISBN :
0-7803-4756-0
Type :
conf
DOI :
10.1109/ISIE.1998.707767
Filename :
707767
Link To Document :
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