Title :
Ferrite powders for chip inductor device
Author :
Nakamura, T. ; Okano, Y. ; Sugita, N. ; Hatakeyama, K.
Author_Institution :
R&D Div., Toda Kogyo Corp., Hiroshima, Japan
Abstract :
The interfacial diffusion between ferrite and Ag during co-firing was investigated using the SEM-EDX technique. It was found that the diffusion increases with the sintering temperature. Some impurities promote the interfacial diffusion. We proposed ferrite powders suitable for the chip inductor devices
Keywords :
X-ray chemical analysis; copper compounds; diffusion; ferrites; inductors; magnetic particles; nickel compounds; scanning electron microscopy; sintering; surface mount technology; zinc compounds; 4 h; 870 to 950 C; Ag; Ni0.2Zn0.6Cu0.2Fe2O 4; Ni0.2Zn0.6Cu0.2Fe2O 4-Ag -Ni0.2Zn0.6Cu0.2Fe2O4 ; SEM-EDX technique; chip inductor device; co-firing; ferrite powders; impurities; interfacial diffusion; sintering temperature; surface mounting device; Electrodes; Ferrites; Frequency; Impurities; Inductors; Magnetic materials; Powders; Production; Temperature; Zinc oxide;
Conference_Titel :
Electromagnetic Compatibility, 1999 International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
4-9980748-4-9
DOI :
10.1109/ELMAGC.1999.801347
