Title :
Thin film modeling and simulation for long off chip interconnection lines
Author :
Kaller, Dierk ; Klink, E.
Abstract :
The paper describes the modeling and simulation of thin film interconnection lines with frequency dependent attenuation. It compares different modeling approaches and shows, for which lengths frequency dependency due to the large resistance is no longer negligible. Signal integrity is discussed for the coupled noise, where two horizontal neighbors are considered. The performance impact of the coupled lines is shown for four different operation modes
Keywords :
circuit analysis computing; integrated circuit interconnections; packaging; wiring; IC interconnections; coupled noise; frequency dependency; frequency dependent attenuation; horizontal neighbors; off chip interconnection lines; operation modes; packaging; signal integrity; thin film modeling; wiring;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564759
