DocumentCode
3271729
Title
Thin film modeling and simulation for long off chip interconnection lines
Author
Kaller, Dierk ; Klink, E.
fYear
1996
fDate
28-30 Oct 1996
Firstpage
11
Lastpage
13
Abstract
The paper describes the modeling and simulation of thin film interconnection lines with frequency dependent attenuation. It compares different modeling approaches and shows, for which lengths frequency dependency due to the large resistance is no longer negligible. Signal integrity is discussed for the coupled noise, where two horizontal neighbors are considered. The performance impact of the coupled lines is shown for four different operation modes
Keywords
circuit analysis computing; integrated circuit interconnections; packaging; wiring; IC interconnections; coupled noise; frequency dependency; frequency dependent attenuation; horizontal neighbors; off chip interconnection lines; operation modes; packaging; signal integrity; thin film modeling; wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564759
Filename
564759
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