DocumentCode
3271936
Title
Thermal Conductivity Measurement about Fluid and Solid
Author
Liu Yinghui
Author_Institution
Hunan Univ. of Technol., Zhuzhou, China
fYear
2013
fDate
16-18 Jan. 2013
Firstpage
1570
Lastpage
1573
Abstract
In the paper, transient hot wire method was presented to test thermal conductivity of the fluid and solid. The superiority of transient hot wire method was introduced. The parallel-plate instrument and heat flow-meter instrument have faster, more accurate and efficient measurement of the thermal conductivity of materials.
Keywords
thermal conductivity; thermal conductivity measurement; heat flow-meter instrument; parallel-plate instrument; thermal conductivity measurement; transient hot wire method; Conductivity; Heating; Instruments; Solids; Temperature measurement; Thermal conductivity; Data treatment; Heat flow-meter instrument; Thermal conductivity; Transient hot wire method;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent System Design and Engineering Applications (ISDEA), 2013 Third International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4673-4893-5
Type
conf
DOI
10.1109/ISDEA.2012.377
Filename
6455228
Link To Document