• DocumentCode
    3272317
  • Title

    Enhancing dual-Vt design with consideration of on-chip temperature variation

  • Author

    Gu, Junjun ; Qu, Gang ; Yuan, Lin

  • Author_Institution
    Univ. of Maryland, College Park, MD, USA
  • fYear
    2010
  • fDate
    3-6 Oct. 2010
  • Firstpage
    542
  • Lastpage
    547
  • Abstract
    Dual-Vt technology is effective in leakage reduction and has been implemented in industry EDA tools. However, on-chip temperature is regarded as uniformly distributed over the chip, with a pre-assumed value. This assumption does not hold for designs in the deep sub-micron domain as on-chip temperature variation becomes more and more significant. As a result, treating temperature as a constant will either lead to non-optimal design in terms of leakage or unreliable circuit due to potential hot spots that have temperature higher than expected. In this paper, we propose a temperature-aware approach that leverages the on-chip temperature variation and takes into account the coupling effects between leakage and temperature to enhance the leakage reduction of any dual-Vt assignment algorithm. We synthesize and implement Opencore benchmarks using Synopsys tools and TSMC´s 65nm low power dual-Vt library. The results show that we are able to improve the performance of a state-of-the-art dual Vt algorithm by an average of 11.2% in leakage saving, a more than 1.4°C drop of peak temperature, and a significant reduction of cells in hot regions without timing failure.
  • Keywords
    electronic design automation; low-power electronics; power aware computing; system-on-chip; EDA tool; Opencore benchmark; Synopsys tool; TSMC; dual-Vt assignment algorithm; dual-Vt design; leakage reduction; low power dual-Vt library; on-chip temperature variation; temperature-aware approach; Complexity theory; Delay; Integrated circuit modeling; Libraries; Solid modeling; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design (ICCD), 2010 IEEE International Conference on
  • Conference_Location
    Amsterdam
  • ISSN
    1063-6404
  • Print_ISBN
    978-1-4244-8936-7
  • Type

    conf

  • DOI
    10.1109/ICCD.2010.5647619
  • Filename
    5647619