Title :
Design and modeling of compact on-chip transformer/balun using multi-level metal windings for RF integrated circuits
Author :
Tao Liang ; Gillis, J. ; Wang, D. ; Cooper, P.
Author_Institution :
Boston Design Center, IBM Microelectron., Lowell, MA, USA
Abstract :
A compact integrated balun transformer is analyzed that meets the size demand of highly integrated RFICs for the wireless industry. The design of a balun transformer with 4:1 impedance ratio using multi-level windings significantly reduces the silicon area compared to that occupied by an equivalent planar design. Its application is demonstrated in a highly efficient, linear amplifier design which achieved first pass design success.
Keywords :
BiCMOS integrated circuits; UHF amplifiers; UHF integrated circuits; baluns; integrated circuit design; RF integrated circuits; first pass design success; impedance ratio; linear amplifier design; multi-level metal windings; on-chip transformer/balun; wireless industry; Conductivity; Dielectric substrates; Impedance matching; Inductance; Inductors; RF signals; Radio frequency; Radiofrequency integrated circuits; Silicon; Spirals;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2001. Digest of Papers. 2001 IEEE
Conference_Location :
Phoenix, AZ, USA
Print_ISBN :
0-7803-6601-8
DOI :
10.1109/RFIC.2001.935655
