• DocumentCode
    3272527
  • Title

    Trade-off analyses in system designs and some implications to manufacturing

  • Author

    Arabi, T. ; Riendeau, D. ; Tripp, M.

  • Author_Institution
    Sort/Test Technol. Dev., Intel Corp., Hillsboro, OR
  • fYear
    1996
  • fDate
    28-30 Oct 1996
  • Firstpage
    18
  • Lastpage
    20
  • Abstract
    Microprocessor speeds continue to double with every silicon generation. Consequently, the design and test margins continue to decrease very rapidly. With these decreasing margins, errors in the design and design validation phases of high-speed systems can cause direct yield hits at the desired frequency of operation. It is shown in this paper that estimating the system performance and carrying out the trade-off analyses based on the absolute worst case design/test are overly restrictive and can be misleading
  • Keywords
    digital circuits; failure analysis; packaging; printed circuit design; statistical analysis; absolute worst case design/test; design validation; high speed systems; manufacturing; system design; system performance estimation; test margins; tradeoff analyses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
  • Conference_Location
    Napa, CA
  • Print_ISBN
    0-7803-3514-7
  • Type

    conf

  • DOI
    10.1109/EPEP.1996.564763
  • Filename
    564763