DocumentCode
3272527
Title
Trade-off analyses in system designs and some implications to manufacturing
Author
Arabi, T. ; Riendeau, D. ; Tripp, M.
Author_Institution
Sort/Test Technol. Dev., Intel Corp., Hillsboro, OR
fYear
1996
fDate
28-30 Oct 1996
Firstpage
18
Lastpage
20
Abstract
Microprocessor speeds continue to double with every silicon generation. Consequently, the design and test margins continue to decrease very rapidly. With these decreasing margins, errors in the design and design validation phases of high-speed systems can cause direct yield hits at the desired frequency of operation. It is shown in this paper that estimating the system performance and carrying out the trade-off analyses based on the absolute worst case design/test are overly restrictive and can be misleading
Keywords
digital circuits; failure analysis; packaging; printed circuit design; statistical analysis; absolute worst case design/test; design validation; high speed systems; manufacturing; system design; system performance estimation; test margins; tradeoff analyses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564763
Filename
564763
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