DocumentCode :
3273139
Title :
Characterization of onset tunneling voltage (Vonset) walkout in high-voltage deep trench isolation on SOI
Author :
Thuy Dao ; Mu-Ling Ger ; Jiangkai Zuo
Author_Institution :
Freescale Semicond., Inc., Austin, TX, USA
fYear :
2015
fDate :
1-3 June 2015
Firstpage :
1
Lastpage :
4
Abstract :
Deep trench isolation (DTI) with “walkout” onset tunneling voltage (Vonset) can cause serious confusion for performance enhancement and process optimization in technology development. The ordinary breakdown voltage (BV) “walkout” phenomenon occurs when a premature avalanche breakdown injects high energy carriers into an oxide so that subsequent stress may causes an increase in oxide breakdown voltage [1]. However, the increase in the Vonset with multiple I-V sweeps for our DTI structures are of very different origins. This is the first report on the characterization of Vonset “walkout” in HV deep trench isolation (DTI) on SOI.
Keywords :
avalanche breakdown; isolation technology; optimisation; silicon-on-insulator; tunnelling; DTI structures; SOI; Si; avalanche breakdown injects; energy carrier; high-voltage deep trench isolation; onset tunneling voltage walkout; Diffusion tensor imaging; Electric breakdown; Filling; Stress; Substrates; Tunneling; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IC Design & Technology (ICICDT), 2015 International Conference on
Conference_Location :
Leuven
Type :
conf
DOI :
10.1109/ICICDT.2015.7165909
Filename :
7165909
Link To Document :
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