• DocumentCode
    3273139
  • Title

    Characterization of onset tunneling voltage (Vonset) walkout in high-voltage deep trench isolation on SOI

  • Author

    Thuy Dao ; Mu-Ling Ger ; Jiangkai Zuo

  • Author_Institution
    Freescale Semicond., Inc., Austin, TX, USA
  • fYear
    2015
  • fDate
    1-3 June 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Deep trench isolation (DTI) with “walkout” onset tunneling voltage (Vonset) can cause serious confusion for performance enhancement and process optimization in technology development. The ordinary breakdown voltage (BV) “walkout” phenomenon occurs when a premature avalanche breakdown injects high energy carriers into an oxide so that subsequent stress may causes an increase in oxide breakdown voltage [1]. However, the increase in the Vonset with multiple I-V sweeps for our DTI structures are of very different origins. This is the first report on the characterization of Vonset “walkout” in HV deep trench isolation (DTI) on SOI.
  • Keywords
    avalanche breakdown; isolation technology; optimisation; silicon-on-insulator; tunnelling; DTI structures; SOI; Si; avalanche breakdown injects; energy carrier; high-voltage deep trench isolation; onset tunneling voltage walkout; Diffusion tensor imaging; Electric breakdown; Filling; Stress; Substrates; Tunneling; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IC Design & Technology (ICICDT), 2015 International Conference on
  • Conference_Location
    Leuven
  • Type

    conf

  • DOI
    10.1109/ICICDT.2015.7165909
  • Filename
    7165909