Title :
Implementation of a simulation-based short-term lot arrival forecast in a mature 200mm semiconductor FAB
Author :
Scholl, Wolfgang ; Gan, Boon Ping ; Lendermann, Peter ; Noack, Daniel ; Rose, Oliver ; Preuss, Patrick ; Pappert, Falk Stefan
Author_Institution :
Infineon Technol. Dresden, Dresden, Germany
Abstract :
The ability to perform lot arrival forecast at work center level is a key requirement for pro-active FAB operation management. Visibility to this information enables preemptive resource allocation and bottleneck management. Today, the work center lot arrival forecast is achieved through the use of short term simulation technique in Infineon Dresden. High fidelity simulation model that includes detailed modeling feature such as attribute-based sampling procedure, dedication and temporary tool blocking is built automatically through the transformation of data queries from data sources. In this paper, we present the results of our model validation work, comparing the FAB and forecasted lot arrival of the defect density measurement work center. Due to the high capacity demand of automotive product that requires more than 20 inspection steps; engineering lots and preventive maintenance of DDM must be scheduled at the right time. This can only be achieved with high quality lot arrival forecast.
Keywords :
automotive components; inspection; preventive maintenance; production engineering computing; production management; technological forecasting; D-SIMForecaster; DDM; WIP; attribute-based sampling procedure; automotive product; high fidelity simulation model; inspection; preemptive resource allocation; preventive maintenance; pro-active FAB operation management; semiconductor FAB; short term simulation technique; simulation-based short-term lot arrival forecast; Data models; Databases; Engines; Load modeling; Predictive models; Production; Semiconductor device modeling;
Conference_Titel :
Simulation Conference (WSC), Proceedings of the 2011 Winter
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4577-2108-3
Electronic_ISBN :
0891-7736
DOI :
10.1109/WSC.2011.6147907