Package to board interconnection shear strength (PBISS) behavior at high strain rates approaching mechanical drop

Interconnection shear strength tests performed on three different package constructions at two different test speeds indicate that the deformation of the package to board interconnection is sensitive to these variables. The faster deformation rate used in this study approaches that observed in mechanical drop or shock loading of portable electronic products. The failure mechanisms observed during high rates of deformation include build-up layer and trace fracture for the two ball grid array packages studied, while the land grid array package exhibited primarily solder shear. Results indicate that by choosing the appropriate package type and shear deformation rate, the PBISS test can be used to measure the strength of different elements of the interconnection. Thus the PBISS test can be used as a proxy for the performance of the package under different kinds of mechanical loading.