• DocumentCode
    3273833
  • Title

    Seismic Response Analysis of Deeply Embedded Large Diameter Cylindrical Structure

  • Author

    Cuiping Guo ; Wenjuan Yao

  • Author_Institution
    Dept. of Civil Eng., Shanghai Univ., Shanghai, China
  • fYear
    2013
  • fDate
    16-18 Jan. 2013
  • Firstpage
    1260
  • Lastpage
    1263
  • Abstract
    Nonlinear numerical model of Large Diameter Cylindrical Structure and Soil Interaction is constructed. The Dynamic Response of Large Diameter Cylindrical Structure under measured seismic wave is studied. The following conclusions can be obtained: the displacement change of cylinder at the free end is the biggest, the stress of cylinder at the bottom is the biggest and has large circumferential moment, the There is a rotating point between the structural midpoint and the bottom, the structure and the soil inside cylinder rotates around the rotating point. There is a certain lag in the displacement curve compared to the curve of seismic wave acceleration, the peak time-point of speed response curve is slightly earlier than that of displacement response curve, but the shape of the two curves is similar. Results can provide evidence for the design of deeply embedded large diameter cylinder.
  • Keywords
    acceleration; dynamic response; geotechnical engineering; seismology; shapes (structures); soil; stress analysis; structural engineering; vibrations; circumferential moment; deeply embedded large diameter cylindrical structure; displacement change; displacement response curve; dynamic response; nonlinear numerical model; seismic response analysis; seismic wave acceleration; soil interaction; speed response curve; stress; structural midpoint; Acceleration; Finite element methods; Mathematical model; Numerical models; Seismic waves; Soil; Stress; deeply embedded large diameter cylinder; nonlinear numerical model; seismic dynamic response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent System Design and Engineering Applications (ISDEA), 2013 Third International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4673-4893-5
  • Type

    conf

  • DOI
    10.1109/ISDEA.2012.296
  • Filename
    6455595