DocumentCode
327387
Title
Insulating materials for super-conductors, their characteristics at cryogenic temperature
Author
Husain, Ekram ; Mohsin, M.M. ; Naqvi, S.R.S.
Author_Institution
Dept. of Electr. Eng., Aligarh Muslim Univ., India
fYear
1998
fDate
22-25 Jun 1998
Firstpage
361
Lastpage
364
Abstract
Liquid nitrogen (LN2) and cryogenic nitrogen (CGN2 ) are found suitable not only as coolants but also as insulating materials for high critical temperature superconductors (HTSC). Experimental studies have been carried out to evaluate the dielectric strength of LN2, under varying field conditions. Experiments were also performed with CGN2 and solid insulting materials immersed in LN2 using spherical electrodes. The breakdown strength of insulating materials has been found to increase significantly at cryogenic temperatures in comparison to atmospheric temperatures. The increase in breakdown strength of insulating materials like cotton tape, empire tape, Leatheroid paper, varnished paper, Presspahn, Bakelite sheet and mica is comparatively large with respect to materials like P.V.C., minimax and perspex. No apparent physical change was noticed in case of cotton tape, empire tape, Leatheroid paper, varnished paper, Presspahn, Bakelite sheet and mica, when immersed in LN2 while minimax P.V.C. and perspex sheet got hardened and colour of rest pieces of these materials got faded till they remained immersed in LN2
Keywords
electric strength; high-temperature superconductors; insulating materials; Leatheroid paper; N2; PVC; Presspahn; bakelite sheet; breakdown; coolant; cotton tape; cryogenic characteristics; cryogenic nitrogen; dielectric strength; empire tape; high temperature superconductor; insulating material; liquid nitrogen; mica; minimax; perspex; varnished paper; Cotton; Cryogenics; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Minimax techniques; Nitrogen; Sheet materials; Superconducting materials; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Conduction and Breakdown in Solid Dielectrics, 1998. ICSD '98. Proceedings of the 1998 IEEE 6th International Conference on
Conference_Location
Vasteras
Print_ISBN
0-7803-4237-2
Type
conf
DOI
10.1109/ICSD.1998.709300
Filename
709300
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