DocumentCode :
3273986
Title :
Calibration of near field measurements using microstrip line for noise predictions
Author :
Srinivasan, Krishna ; Sasaki, Hideki ; Swaminathan, Madhavan ; Tummala, Rao
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
1432
Abstract :
In this paper, near-field measurements from a microstrip line, obtained using an NEC probe, are presented for frequencies over a wide bandwidth from 250 MHz to 3 GHz. Near-field measurements obtained using the NEC probe are in good agreement with HFSS simulation results and analytical models. It has been shown through experimental near-field measurements and numerical simulations that the return current on the ground plane of a microstrip line, although small in areas on the ground plane away from the signal line, produces a significant magnetic field. Circuits placed above the area where the magnetic field strength is large will experience strong electromagnetic interference. Near-field measurements help with placement of circuits to realize systems with minimal electromagnetic coupling. This research work is leading to the development of design guidelines for reducing the effect of EMI in microelectronic systems.
Keywords :
calibration; circuit noise; circuit simulation; coupled circuits; electromagnetic coupling; electromagnetic interference; microstrip lines; 250 MHz to 3 GHz; EMI reduction; HFSS simulation; circuit noise predictions; electromagnetic coupling; electromagnetic interference; ground plane return current; microstrip line; near field measurement calibration; near-field electromagnetic coupling; return current effects; return current magnetic field; Analytical models; Calibration; Electromagnetic interference; Electromagnetic measurements; Frequency measurement; Magnetic field measurement; Microstrip; National electric code; Noise measurement; Probes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1320301
Filename :
1320301
Link To Document :
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