Embedded optical interconnections on printed wiring boards

Author

Suzuki, Takeshi ; Nonaka, Toshihisa ; Ogawa, Nobuyuki ; Cho, Sang-Yeon ; Seo, Sang-Woo ; Jokerst, Nan Marie

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

1524

Abstract

Optical interconnections using fully embedded optoelectronic components offer high performance interconnection options that can be integrated into current printed wiring board electrical interconnection systems. In this paper, we demonstrate fully embedded optical interconnections on commercially available printed wiring board (PWB) using an embedded thin film metal-semiconductor-metal (MSM) photodetector. The detailed fabrication steps and process conditions are described in this paper. The photocurrent to dark current ratio for the embedded photodetector was over 100, and the measured impulse response of the fabricated embedded MSM photodetector was 22 ps.

Keywords

dark conductivity; integrated optoelectronics; metal-semiconductor-metal structures; optical interconnections; optical receivers; photoconductivity; photodetectors; printed circuits; transient response; 22 ps; PWB; embedded MSM photodetector; embedded optical interconnections; embedded optoelectronic components; embedded thin film metal-semiconductor-metal photodetector; fabrication steps; impulse response; photocurrent to dark current ratio; printed wiring board electrical interconnection systems integration; process conditions; Costs; Electromagnetic waveguides; Optical films; Optical interconnections; Optical materials; Optical waveguides; Photodetectors; Planar waveguides; Substrates; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1320317

Filename

1320317