DocumentCode :
3274443
Title :
Demonstration of an MT-compatible connectorisation of a laser-ablated optical interconnection on a printed circuit board
Author :
Van Steenberge, Geert ; Geerinck, Peter ; Van Put, Steven ; Van Koetsem, Jan ; Morlion, Danny ; Van Daele, Peter
Author_Institution :
Dept. of Inf. Technol., Univ. Gent, Belgium
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
1552
Abstract :
Integration of optical interconnections on a Printed Circuit Board (PCB) is very challenging, as compatibility should be maintained with standard PCB manufacturing technology. This paper describes the use of laser ablation, a technique already used in PCB manufacturing for drilling microvia´s, as a suitable technique for the fabrication of multimode polymer waveguides, micromirrors, alignment features and microlenses. A frequency tripled Nd-YAG laser and a KrF excimer laser are used, both mounted on the same stage, resulting in a very high alignment accuracy. We demonstrate a parallel optical link over about 5 cm long PCB integrated waveguides, fully connectorised using a standard MT-based connector. This proves that laser ablation can be a key technology in optical board manufacturing to reach the stringent coupling tolerances.
Keywords :
laser ablation; microlenses; micromirrors; optical backplanes; optical communication equipment; optical planar waveguides; printed circuit manufacture; MT-compatible connectorisation; alignment features; board-level interconnects; deflecting optics; excimer laser; frequency tripled laser; integrated waveguides; laser-ablated optical interconnection; microlenses; micromirrors; multimode polymer waveguides; optical board manufacturing; parallel optical link; printed circuit board; Drilling; Integrated circuit manufacture; Laser ablation; Optical device fabrication; Optical interconnections; Optical waveguides; Polymers; Printed circuits; Pulp manufacturing; Waveguide lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1320322
Filename :
1320322
Link To Document :
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