Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)

Author

Lau, John H. ; Shangguan, Dongkai ; Lau, D.C.Y. ; Kung, Terry T W ; Lee, S. W Ricky

Author_Institution

Agilent Technol. Inc., Santa Clara, CA, USA

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

1563

Abstract

A new thermal-fatigue life prediction equation for a class of lead-free solder alloys, 95.5wt%Sn3.9-4.0wt%Ag0.5-0.6wt%Cu is proposed in this investigation. The test vehicle consists of a lead-free solder-bumped WLCSP, lead-free PCB, and lead-free solder paste. The coefficients of the fatigue equation presented herein are determined by best fitted with the isothermal fatigue data of the test vehicle. Failure modes and locations of the failed samples are discussed.

Keywords

chip scale packaging; copper alloys; fatigue testing; flip-chip devices; integrated circuit reliability; reflow soldering; silver alloys; solders; thermal stress cracking; tin alloys; SnAgCu; failure locations; failure modes; flip-chip solder joints; isothermal fatigue; lead-free printed circuit board; lead-free solder joints; reflow temperature profile; solder paste printing; thermal-fatigue life prediction equation; wafer-level chip scale package; Chip scale packaging; Circuit testing; Environmentally friendly manufacturing techniques; Equations; Fatigue; Lead; Printed circuits; Soldering; Vehicles; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1320324

Filename

1320324