Title :
Fatigue life estimation of a stretched-solder-column ultra-fine-pitch wafer level package using the macro-micro modelling approach
Author :
Chng, Audrey C. ; Tay, Andrew A O ; Lim, K.M. ; Wong, E.H.
Author_Institution :
Nano/Microsystems Integration Lab., Nat. Univ. of Singapore, Singapore
Abstract :
This paper presents package warpage and interconnect fatigue life estimates of stretched-solder-column interconnections in a 20mm×20mm package with 100 μm pitch. The modelling was carried out in two stages using the macro-micro modelling approach. The effect of interconnection height, as well as chip thickness and substrate CTE (coefficient of thermal expansion) on fatigue life is discussed. The results suggest that the substrate CTE will continue to be the key factor in determining the thermomechanical reliability of a large package with small interconnections.
Keywords :
ball grid arrays; chip scale packaging; fatigue; fine-pitch technology; finite element analysis; integrated circuit interconnections; integrated circuit reliability; reflow soldering; solders; thermal management (packaging); thermal stress cracking; FEA code; applied plastic shear strain; beam elements; chip thickness; fatigue life estimation; high lead solder interconnect; interconnect fatigue life estimates; interconnection height; large package; macro-micro modelling; package warpage estimates; shell elements; small interconnections; stretched-solder-column package; substrate CTE; thermomechanical reliability; ultrafine-pitch wafer level package; Capacitive sensors; Fatigue; Lead; Life estimation; Microelectronics; Packaging; Semiconductor device modeling; Temperature; Thermal expansion; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1320327
