An analytical model for thermal stress analysis of multi-layered microelectronics packaging

Author

Wen, Yujun ; Basaran, Cemal

Author_Institution

Electron. Packaging Lab., State Univ. of New York, Buffalo, NY, USA

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

1592

Abstract

Compared to numerical methods, analytical solutions can offer a faster and more accurate procedure for obtaining the interfacial stresses in laminated structures. An analytical model for thermal stress analysis of multi-layered thin stacks on a thick substrate under isothermal loading is proposed in this paper. This analytical approach considers each layer as a beam-type plate with orthotropic material properties. Highly sensitive Moire interferometry is used to validate the model. The strain field in the bi-material interfaces is obtained experimentally. The test data is in good agreement with the proposed analytical solution. Finite element analysis results are also compared with the analytical solution and the test data.

Keywords

laminates; mathematical analysis; stress analysis; thermal management (packaging); thermal stresses; analytical model; beam-type plate; constitutive equations; finite element analysis; interfacial compliances; interfacial stresses; isothermal loading; laminated structures; moire interferometry; multilayered microelectronics packaging; orthotropic material properties; peeling stresses; thermal stress analysis; thick substrate; thin stacks; Analytical models; Capacitive sensors; Interferometry; Isothermal processes; Material properties; Microelectronics; Packaging; Testing; Thermal loading; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1320328

Filename

1320328