A novel highly heat-resistant substrate material for halogen-free applications

Author

Hirota, Kousuke ; Shima, Kenji ; Iiyama, Takashi

Author_Institution

Mitsui Chemicals Inc., Chiba, Japan

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

1622

Abstract

A novel halogen-free laminate for IC package substrate has been developed, based on molecular-level designing of polymer networks. Utilization of high-LOI (limiting oxygen index) resin constituents contributes to enhance flame resistance of the resin itself and to lower the content of metal hydrate as flame retardant. In this paper, we compared the properties of halogen-free laminates, especially those which influence significantly on the package reliability. The newly developed halogen-free laminate "BN300GF" has its glass transition temperature over 300°C and shows superior resistance against beat and chemical treatment.

Keywords

filled polymers; flame retardants; flammability; integrated circuit packaging; integrated circuit reliability; laminates; life testing; substrates; thermal management (packaging); IC package substrate; accelerated test; chemical resistance; chemical stability; flame resistance; glass transition temperature; halogen-free laminate; highly heat-resistant substrate materia; humidity stress test; limiting oxygen index resin constituents; metal hydrate flame retardant; molecular-level design; package reliability; polymer networks; temperature test; Chemical compounds; Fires; Immune system; Integrated circuit packaging; Laminates; Polymers; Resins; Resistance heating; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1320332

Filename

1320332