• DocumentCode
    3274756
  • Title

    In-phase power combining of submillimeter-wave multipliers

  • Author

    Maestrini, Alain ; Ward, John ; Chattopadhyay, Goutam ; Schlecht, Erich ; Gill, John ; Lee, Choonsup ; Javadi, Hamid ; Mehdi, Imran

  • Author_Institution
    LERMA, Univ. Pierre et Marie Curie-Paris 6, Paris
  • fYear
    2008
  • fDate
    15-19 Sept. 2008
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Submillimeter-wave multiplier circuits can either be optimized for maximum efficiency or maximum output power depending on the application. However, it is always desirable to have maximum output power without sacrificing efficiency. To accomplish this goal we have proposed and demonstrated in-phase power combining of submillimeter-wave multiplier chips. We report on the design, fabrication and characterization of a 260-340 GHz tripler that utilizes two mirror-image chips and produces a peak of 22 mW with 11% efficiency. This source is then used to drive a two-chip 790-950 GHz tripler. Preliminary results obtained from this LO chain are 0.7 mW at 890 GHz at room temperature. This technology advancement now makes it possible to extend the frequency coverage of multiplier based sources well into the THz range.
  • Keywords
    frequency multipliers; power combiners; submillimetre wave devices; submillimetre wave integrated circuits; efficiency 11 percent; frequency 260 GHz to 340 GHz; frequency 890 GHz; in-phase power-combined frequency triplers; mirror-image chips; power 0.7 mW; power 22 mW; submillimeter-wave multipliers; temperature 293 K to 298 K; tripler design; tripler fabrication; Anodes; Bandwidth; Circuits; Frequency; Gallium arsenide; Power generation; Power measurement; Schottky diodes; Semiconductor device measurement; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Infrared, Millimeter and Terahertz Waves, 2008. IRMMW-THz 2008. 33rd International Conference on
  • Conference_Location
    Pasadena, CA
  • Print_ISBN
    978-1-4244-2119-0
  • Electronic_ISBN
    978-1-4244-2120-6
  • Type

    conf

  • DOI
    10.1109/ICIMW.2008.4665533
  • Filename
    4665533