DocumentCode
3274999
Title
Research and education in MEMS and optoelectronics packaging in china
Author
Liu, Sheng ; Gan, Zhiyin ; Li, Peigen ; Sun, Lining ; Gong, Li
Author_Institution
Inst. of Microsystems, Huazhong Univ. of Sci. & Technol., Wuhan, China
Volume
2
fYear
2004
fDate
1-4 June 2004
Firstpage
1712
Abstract
A review of research and education in MEMS and optoelectronic packaging research in China is given in terms of the major institutions, equipment, research topics. The author also discusses major activities of China in MEMS and optoelectronic packaging.
Keywords
educational courses; educational institutions; electronic engineering education; further education; integrated circuit packaging; integrated optoelectronics; micromechanical devices; semiconductor device packaging; China institutions; MEMS packaging education; MEMS packaging research; collaborations; commercialization; educational institutions; graduate students; optoelectronic packaging education; optoelectronic packaging research; research institutes; undergraduate students; Bonding; Commercialization; Electronics packaging; Manufacturing; Microelectronics; Micromechanical devices; Optical fibers; Packaging machines; Rivers; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1320348
Filename
1320348
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