Title :
Process technology of electronics - a graduate textbook
Author :
Zerna, Thomas ; Oppermann, Martin ; Sauer, Wilfried ; Wolter, Klaus-juergen
Author_Institution :
Electron. Packaging Lab., Dresden Univ. of Technol., Germany
Abstract :
The Electronics Packaging Laboratory (German abbreviation: IAVT) of Dresden University of Technology is focused on research and education in the field of the production of electronic modules and devices. Together with the Centre of Microtechnical Manufacturing (German abbreviation: ZμP), which is also a part of the Department of Electrical Engineering and Information Technology, many projects are realized. Beside this there is also a long tradition and a lot of scientific experiences in process technology, which means all questions of analyzing, describing, modeling, simulating and calculating production processes with special focus on electronics production. A number of lectures are offered. Beginning of 2003 a group of scientists of both the Electronics Packaging Lab and the Center of Microtechnical Manufacturing decided to write a summarized textbook about process technology. Edited by Prof. Wilfried Sauer the book was issued in September 2003. It is useful as a textbook for the different lectures during the main (graduate) study of Electrical Engineering, specialization Electronics Packaging, as well as a summary of the whole scientific field of process technology of electronics.
Keywords :
educational courses; electronic engineering education; electronics industry; electronics packaging; further education; industrial engineering; electrical engineering curriculum; electronic products manufacturing; electronics packaging; graduate textbook; process knowledge; process technology of electronics; technological knowledge; Conductive adhesives; Educational technology; Electronics packaging; Flip chip; Information technology; Laboratories; Manufacturing processes; Optical interconnections; Optimized production technology; Substrates;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1320350