Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Abstract :
Microelectromechanical systems (MEMS) merging integrated sensors, microactuators, and low-power electronics are rapidly growing in sophistication. Projection displays, IR/thermal imagers, print heads, microphones, accelerometers and gyros are all emerging based on this technology. Using embedded microprocessors, complete microsystems employing self-testing and digital compensation promise to achieve levels of reliability and accuracy previously impossible at low cost. Sensors for advanced semiconductor process tools, modules for distributed environmental monitoring, inertial-grade navigation aids, advanced security systems, and mass storage devices are a few of the applications being targeted. The technology choices, device structures, applications, and tradeoffs in this area are examined in this paper along with future challenges.
Keywords :
built-in self test; environmental testing; integrated circuit reliability; integrated circuit testing; micromechanical devices; accelerometers; advanced security systems; digital compensation; distributed environmental monitoring; embedded microprocessors; gyros; inertial-grade navigation aids; integrated sensors; low-power electronics; mass storage devices; microactuators; microelectromechanical systems; microphones; print heads; projection displays; reliability; self-testing; thermal imagers; Displays; Head; Low power electronics; Merging; Microactuators; Microelectromechanical systems; Micromechanical devices; Microphones; Rapid thermal processing; Sensor systems;
