Title :
Wideband impedance analysis of a grounded bondwire buried in epoxy molding compounds
Abstract :
The dielectric effects on the parasitics of bondwires buried in slightly-lossy dielectric materials have been investigated over a wide frequency range using the method of moments with incorporation of ohmic and dielectric losses. The input impedance of a grounded bondwire in FR-4 composites is greatly increased due to the dielectric loading effect enhanced by the radiation at high frequencies
Keywords :
dielectric losses; earthing; electric impedance; filled polymers; lead bonding; method of moments; permittivity; plastic packaging; FR-4 composites; dielectric effects; dielectric loading effect; dielectric losses; epoxy molding compounds; grounded bondwire; input impedance; lossy dielectric materials; method of moments; ohmic losses; parasitics; wide frequency range; wideband impedance analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564777
