DocumentCode
3275315
Title
Wideband impedance analysis of a grounded bondwire buried in epoxy molding compounds
Author
Hai-young Lee
fYear
1996
fDate
28-30 Oct 1996
Firstpage
55
Lastpage
57
Abstract
The dielectric effects on the parasitics of bondwires buried in slightly-lossy dielectric materials have been investigated over a wide frequency range using the method of moments with incorporation of ohmic and dielectric losses. The input impedance of a grounded bondwire in FR-4 composites is greatly increased due to the dielectric loading effect enhanced by the radiation at high frequencies
Keywords
dielectric losses; earthing; electric impedance; filled polymers; lead bonding; method of moments; permittivity; plastic packaging; FR-4 composites; dielectric effects; dielectric loading effect; dielectric losses; epoxy molding compounds; grounded bondwire; input impedance; lossy dielectric materials; method of moments; ohmic losses; parasitics; wide frequency range; wideband impedance analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564777
Filename
564777
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