• DocumentCode
    3275695
  • Title

    The Design Study of the Wide Bandwidth and High Gain RFID Microstrip Patch Antenna

  • Author

    Zhu Yongxiang ; Chen Jianjun ; Song Xuerui ; Cao Hongxi

  • Author_Institution
    Sch. of Electr. & Inf. Eng., Hunan Univ. of Technol., Zhuzhou, China
  • fYear
    2013
  • fDate
    16-18 Jan. 2013
  • Firstpage
    1420
  • Lastpage
    1422
  • Abstract
    A design of a wide bandwidth high gain micro strip antenna for RFID is proposed, in which the design of the wide bandwidth is achieved by the dual-band operation, which is realized by loading two symmetric cut down squares at the corner of the ordinary rectangular patch antenna, and changing the surface current distribution on the patch. Based on this, A 4-element array antenna is designed by selecting an appropriate space between every two elements, adopt coaxial probe and the parallel feed network comprised of T-type power distributors. Simulated and optimized by using the software of High Frequency Structure Simulator(HFSS), the simulation results show that the relative impedance bandwidth is about 18.8% for the antenna element and 19.5% for the antenna array, and the gain is about 14.2dB. the method of designing has a good expansibility for particular feeding and the muti-layers micro strip patch antenna.
  • Keywords
    microstrip antenna arrays; multifrequency antennas; 4 element array antenna; T-type power distributor; antenna array; antenna element; dual band operation; high frequency structure simulator; high gain RFID microstrip patch antenna; mutilayers microstrip patch antenna; ordinary rectangular patch antenna; parallel feed network; relative impedance bandwidth; surface current distribution; wide bandwidth; Antenna feeds; Arrays; Bandwidth; Microstrip; Microstrip antenna arrays; Microstrip antennas; Resonant frequency; Array Antenna; Cutdown; High Gain; Microstrip Antenna; Wide Bandwidth;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent System Design and Engineering Applications (ISDEA), 2013 Third International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4673-4893-5
  • Type

    conf

  • DOI
    10.1109/ISDEA.2012.338
  • Filename
    6455999