Photolithography of 3D topology in Si optical bench for self-aligned placement of laser dies

Author

Li, M. ; Tsang, H.K. ; Shu, C. ; Wei, C.C. ; Law, C.W. ; Lau, Y.K. ; Kwok, R.W.M. ; Hu, X.W. ; Zhu, H.L.

Author_Institution

Shipley Asia Technol. Center, Shipley Asia Ltd., Hong Kong, China

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

1925

Abstract

The purpose of the investigation is to develop a prototype hybrid package to integrate an InGaAsP laser diode array with an array of waveguides on the Si optical bench (SiOB) using solder-bumped flip chip technology.

Keywords

III-V semiconductors; flip-chip devices; gallium arsenide; indium compounds; optical fabrication; optical planar waveguides; photolithography; reflow soldering; semiconductor device packaging; semiconductor laser arrays; silicon-on-insulator; sputter etching; 3D topology; InGaAsP; SOI wafer; active laser; alignment accuracy; deep etching; laser dies; laser diode array; low cost optoelectronic packaging; passive self-aligned hybrid integration; photolithography; prototype hybrid package; self-aligned placement; silicon optical bench; solder volume variation; solder-bumped flip chip technology; waveguides array; Diode lasers; Integrated optics; Lithography; Optical arrays; Optical waveguides; Packaging; Prototypes; Semiconductor laser arrays; Topology; Waveguide lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1320385

Filename

1320385