• DocumentCode
    3276024
  • Title

    A novel silica planar waveguide structure with high thermal efficiency

  • Author

    Yu, E. ; Zheng, D.W.

  • Volume
    2
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    2002
  • Abstract
    Silica based integrated planar waveguide technology plays an importance role in the modem optical communication space. Almost all of the current devices made utilize the "channel-waveguide" structure and have poor thermal efficiency in general. A novel silica planar waveguide structure, where a ridge waveguide resides in a vacuum gap, was demonstrated with low insertion loss and significantly higher thermal efficiency. One third of the power was found sufficient to achieve PI phase change for a 5 mm long waveguide, in comparison to the conventional planar lightwave circuits. Simulation results also showed minimal thermal cross talk. Temperature rises in the neighboring channels, resulting from thermal cross talk, are about 1% of the heated channel. No penalty has been observed on the transient thermal response in simulations. The authors believe that this new waveguide structure will lead to low power devices like splitters and variable optical attenuators.
  • Keywords
    optical communication equipment; optical planar waveguides; ridge waveguides; silicon compounds; transient response; 5 mm; PI phase change; SiO2; channel-waveguide structure; high thermal efficiency structure; insertion loss; integrated planar waveguide technology; optical communication; planar lightwave circuits; silica planar waveguide structure; splitters; thermal cross talk; transient thermal response; vacuum gap based ridge waveguide; variable optical attenuators; Circuit simulation; Modems; Optical fiber communication; Optical losses; Optical planar waveguides; Optical waveguides; Planar waveguides; Silicon compounds; Space technology; Waveguide discontinuities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1320402
  • Filename
    1320402