Physics-based reliability assessment of embedded passives

Author

Daman, Manoj ; Pucha, Raghuram V. ; Bhattacharya, Swapan ; Tummala, Rao ; Sitaraman, Suresh

Author_Institution

Comput. Aided Simulation for Packaging Reliability Lab., George W. Woodruff Sch. of Mech. Eng., Atlanta, GA, USA

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

2027

Abstract

The integration of passives into boards requires research in process steps, material synthesis and characterization, thermomechanical-electrical modeling, fabrication and reliability testing. The literature available on the thermo-mechanical reliability of integral passives and its relation to system level reliability is limited. The reliability of integral passives under thermal excursions through physics-based models is presented in this paper. The thermo-mechanical failure mechanisms and their influence on system electrical parameters (R, L and C parameters) are discussed.

Keywords

RLC circuits; capacitors; circuit reliability; deformation; delamination; failure analysis; finite element analysis; inductors; network analysis; printed circuits; resistors; thermal stress cracking; PCB physics-based reliability assessment; RLC parameters; cracking; deformation; delamination; embedded capacitors; embedded inductors; embedded passives; embedded resistors; failure mechanisms; finite element model; reliability testing; thermal cycling; thermal excursions; thermally induced stresses; thermo-mechanical-electrical modeling; Capacitors; Delamination; Electric variables; Inductors; Materials reliability; Polymer films; Resistors; Temperature; Thermal stresses; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1320407

Filename

1320407