High-frequency measurement based characterisation of the transmission line parameters of packages and interconnection structures

Author

Sercu, Stefaan ; Martens, Luc

Author_Institution

Dept. of Inf. Technol., Ghent Univ.

fYear

1996

fDate

28-30 Oct 1996

Firstpage

67

Lastpage

70

Abstract

In this paper a technique is presented for high-frequency circuit modeling of coupled interconnection structures such as high-density connectors and large pin count electronic packages. The generated circuit model consists out of basic cells the number of which is function of the length and the bandwidth of the model. The problems associated with the modeling of a high number of coupled conductors are reduced to the modeling of two-conductor and three-conductor structures

Keywords

equivalent circuits; high-frequency transmission line measurement; integrated circuit interconnections; packaging; transmission line theory; HF circuit modeling; HF measurement based characterisation; circuit model; coupled interconnection structures; high-density connectors; high-frequency measurement; interconnection structures; large pin count electronic packages; packaging; three-conductor structures; transmission line parameters; two-conductor structures;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting

Conference_Location

Napa, CA

Print_ISBN

0-7803-3514-7

Type

conf

DOI

10.1109/EPEP.1996.564783

Filename

564783