Study on Aging Characteristics of Polyimide Film Based on Dielectric Loss

Author

He, J.Y. ; Wu, G.N. ; Gao, B. ; Lei, K.G. ; Wu, J.D.

Author_Institution

School of Electrical Engineering of Southwest Jiaotong Universtiy, Chengdu, 610031, Sichuan, China. E-mail: hejingyan81@sina.com.cn

fYear

2007

fDate

8-13 July 2007

Firstpage

158

Lastpage

161

Abstract

In this paper, accelerated aging test was conducted on polyimide (PI) film under the conditions of electrical, thermal and electrical-thermal stresses. In the period of aging, four polyimide film samples were tested and the value of tan Â¿ and sample capacity were measured by DELTA-2000 and HIOKI3532-50LCR to investigate influence of tan Â¿ and capacity under different aging additions. According to the analysis of the experiment data, it definitely indicates that the physical process of capacity with aging time was identical with analysis of experimental result of dielectric loss. Electrical aging plays the most important role in affecting tan Â¿, and thermal aging leaded to decreasing of tan Â¿ as the function of thermal cleaning in some degree. According to dielectric spectrum analysis, it was suggested that the peak point of tan Â¿ curve under different frequency could be used to describe the aging characteristics of insulation.

Keywords

Accelerated aging; Cleaning; Conductive films; Dielectric films; Dielectric losses; Dielectric measurements; Polyimides; Testing; Thermal conductivity; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid Dielectrics, 2007. ICSD '07. IEEE International Conference on

Conference_Location

Winchester, UK

Print_ISBN

1-4244-0750-8

Electronic_ISBN

1-4244-0751-6

Type

conf

DOI

10.1109/ICSD.2007.4290777

Filename

4290777