Title :
Variation aware low power buffered interconnect design
Author :
Narasimhan, Ashok ; Sridhar, Ramalingam
Author_Institution :
Dept. of Comput. Sci. & Eng., Univ. at Buffalo (SUNY), Buffalo, NY, USA
Abstract :
Enhancing interconnect robustness against variations is crucial to system performance and reliability in sub-65 nm technologies. We present a new interconnect design methodology to optimize power consumption and robustness during buffer insertion. Using closed form expressions for interconnect delay and delay variation, we construct a design space for the interconnect. Through power-robustness tradeoff analysis of the design space, the buffering solution that minimizes power consumption while satisfying the delay and robustness constraints is computed. Comparisons with SPICE simulations show the effectiveness of this technique.
Keywords :
buffer circuits; integrated circuit design; integrated circuit interconnections; SPICE simulations; buffer insertion; delay variation; interconnect delay; power consumption; size 65 nm; variation aware low power buffered interconnect design; Delay; Design methodology; Design optimization; Energy consumption; Power system interconnection; Power system reliability; Robustness; SPICE; Space technology; System performance; Delay Variation; Interconnect Delay; Low Power; Optimal Buffer Insertion; Variability;
Conference_Titel :
SOC Conference, 2009. SOCC 2009. IEEE International
Conference_Location :
Belfast
Print_ISBN :
978-1-4244-4940-8
Electronic_ISBN :
978-1-4244-4941-5
DOI :
10.1109/SOCCON.2009.5398020